Noisy Electromagnetic Fields - A Technological Platform for Chip-to-Chip Communication in the 21st Century

Wireless Chip-to-Chip (C2C) communication and wireless links between printed circuit boards operating as Multiple Input Multiple Output devices need to become dominant features of future generations of integrated circuits and chip architectures. They will be able to overcome...

» Source: Cordis

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This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement Nº 760801


            

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